What exactly is substrate-less?
Solving the heat dissipation problem of LEDs! New technology achieves substrate-free design.
"Board-less" refers to a technology that overturns the conventional concept of heat dissipation by enabling three-dimensional mounting without the use of printed circuit boards, thanks to MARBS (three-dimensional wiring technology), which ideally transfers heat to heat sinks. "MARBS" is a next-generation printed circuit board wiring technology that combines two technologies: "nano-level bonding technology" and "three-dimensional wiring technology." This technology allows for a high level of heat dissipation that was previously impossible with conventional boards, enabling complete freedom in LED light distribution design and allowing wiring patterns to be directly formed on curved metal substrates. 【Differences between MARBS and conventional boards】 ■ Enables a high level of heat dissipation that was previously impossible ■ Provides complete freedom in LED light distribution design ■ Allows direct formation of wiring patterns on curved metal substrates ■ Solves LED heat dissipation issues *For more details, please refer to the related link page or feel free to contact us.
- Company：豊光社
- Price：Other
